德律TR7600 SIII CT AXI檢測機系列為TRI新一代具指標性的在線型PCBA檢測解決方案。TR7600SIII AXI檢測機包含可配合生產(chǎn)線速度達到99%檢測覆蓋率的設(shè)計，結(jié)合了業(yè)界速的高解析取像速度，并在業(yè)界的自動X光檢測中大大提升了影像品質(zhì)。
特性：
| ? 超高速3D CT X射線檢測 ? *的影像品質(zhì) ? 真實3D錫點檢視 ? 高解析度可檢測小至01005in晶片 |
Imaging System
| Camera | Ultra-High Speed Line-Scan CCD Cameras (3 or 5 Units) |
| X-ray Source | Microfocus tube 130 kV max (user adjustable) |
| Imaging Resolution | 7 μm, 10 μm, 15 μm, 20 μm (3 settings factory configured) |
| Inspection Method | 2D, 2.5D, 3D Slicing, Planar CT |
Motion Table & Control
| X-Axis Control | High-precision ballscrew + AC-servo controller |
| Y-Axis Control | High-precision ballscrew + AC-servo controller |
| Z-Axis Control | High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution | 1 µm |
Board Handling
| Max PCB Size | 900x460 mm |
| PCB Thickness | 0.6-7 mm |
| Max PCB Weight | 12 kg |
| Top Clearance | @ 20 μm: 50 mm @ 15 μm: 30 mm @ 10 μm: 15 mm @ 7 μm: 7 mm |
| Bottom Clearance | 70 mm |
| Edge Clearance | 3 mm or 5 mm |
| Conveyor Height | 880 - 920 mm * SMEMA Compatible |
Inspection Functions
| Component | Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
| Solder | Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
Dimensions
| WxDxH | 1470 x 2110 x 1975 mm Note: not including signal tower, height: 510 mm |
| Weight | 3850 kg |
| Power Requirement | 200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
